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Wieson Technologies participate in DesignCon the gathering of chip, board, and systems designers in United State

 

DesignCon, the nation’s largest event for chip, board and systems design engineers grand holding on January 29th ~ 31st, January at Santa Clara Convention Center, USA.

DesignCon is the world's premier conference which organized by UBM every year. The show is the world’s premier conference for chip, board & systems design engineers in the high-speed communications and semiconductor communities. The technical conference and expo combine technical Signal & Power Integrity For Single-Multi Die, Interposer & Packaging, System Co-Design. The show is giving the trend of chipset/ PCB design.

Wieson Technologies, our business scope covered to interconnect components, wireless components, optical fiber components and automotive electronics. The market is crossed computer, communication, consumer electronics, automotive industry, etc. And develop the total solutions for surveillance and AIoT relative fields. 

Wieson Technologies is proudly showcased IPC & Waterproof, AIoT, Server & Storage, Wireless Solutions and Applications at booth No.: 853. For more information of products/ solutions, please visit Wieson website for the details: www.wieson.com


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